Characterization of the fatigue properties of bonding wires

Author

Deyhim, Alex ; Yost, Boris ; Lii, Mirng-Ji ; Li, Che-Yu

Author_Institution

Adv. Electron. Packaging Facility, Cornell Univ., Ithaca, NY, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

836

Lastpage

841

Abstract

Bonding wire fatigue reliability is one of the key issues in PPGA (and other cavity type packages) wire bonding process development. This paper describes a unique technique to measure the fatigue properties of bonding wires for IC interconnections. This system allows for long lengths of wire to be strained in bending by wrapping the wire around two mandrels in sequence; the diameter of the mandrels determines the strain at the surface of the wire. Long lengths of wire are managed by winding the wire on 3-inch take up reels of Teflon. Testing at elevated temperatures is accomplished by heating the entire machine. The results of this work clearly show differences in fatigue properties between three types of bonding wire

Keywords

bending; fatigue; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; thermal stresses; IC interconnections; PPGA; bending; bonding wires; cavity type packages; elevated temperature testing; fatigue properties; mandrels; reliability; wire bonding process; Bonding; Capacitive sensors; Electronics packaging; Fatigue; Gold; Materials testing; Packaging machines; Plastics; Thermal stresses; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550505

Filename

550505