• DocumentCode
    2949751
  • Title

    MEMS sensors on flexible substrates towards a smart skin

  • Author

    Ahmed, Mariwan ; Gonenli, I.E. ; Nadvi, G.S. ; Kilaru, R. ; Butler, Donald P. ; Celik-Butler, Zeynep

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper reviews the most recent results on the fabrication and characterization of a variety of microelectromechanical (MEMS) based sensors fabricated on flexible polymer substrates without the loss of performance, towards the development of a smart skin. These sensors include amorphous silicon based temperature sensors; nichrome based piezoresistive, absolute pressure sensors, tactile sensors and force sensors; and capacitive accelerometers. The sensors are sandwiched between a polyimide substrate and superstrate, placing them at a low stress plane, thus packaged at device-level. The flexible sensor package is grown during the device fabrication process. This allows the sensors to be integrated directly with flexible circuit boards to maintain overall flexibility. Some notable features are the incorporation of a sealed vacuum cavity for the absolute pressure sensors and the formation of a hermetically sealed cavity to contain the accelerometers in a constant atmosphere.
  • Keywords
    accelerometers; capacitive sensors; force sensors; intelligent sensors; microsensors; pressure sensors; skin; tactile sensors; temperature sensors; MEMS sensors; absolute pressure sensor; amorphous silicon based temperature sensor; capacitive accelerometers; flexible polymer substrate; flexible sensor package; flexible substrates; force sensors; microelectromechanical based sensor; nichrome based piezoresistive sensor; polyimide substrate; smart skin; tactile sensors; Accelerometers; Micromechanical devices; Polyimides; Sensor phenomena and characterization; Substrates; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411363
  • Filename
    6411363