• DocumentCode
    2949854
  • Title

    10-Gb/s high-density trans-impedance amplifier in 0.18-μm CMOS

  • Author

    Wang, Xiao-Xia ; Wang, Zhi-Gong ; Liu, Ji-Shun ; Lei, Xue-Mei

  • Author_Institution
    Inst. of RF-& OE-ICs, Southeast Univ., Nanjing, China
  • fYear
    2009
  • fDate
    13-15 Nov. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work, a pseudo-differential trans-impedance amplifier (TIA) was designed in a 0.18-¿m CMOS technology. To make it utilized in short-distance, high-density multi-channel optical communication system, modified regulated cascade (MRGC) input configuration and active inductances were exploited to broaden the bandwidth without bringing much penalty to the power consumption and the chip area. The circuit occupies a chip area of 75 ¿m × 80 ¿m. Post-layout simulations demonstrated that a single channel TIA can achieve a trans-impedance of 51.87 dBQ, a bandwidth of 8.5 GHz for 0.3 pF photodiode capacitance. The power consumption is 19 mW.
  • Keywords
    CMOS integrated circuits; operational amplifiers; optical communication; photodiodes; CMOS technology; active inductances; bandwidth 8.5 GHz; bit rate 10 Gbit/s; capacitance 0.3 pF; high-density trans-impedance amplifier; modified regulated cascade input configuration; photodiode capacitance; post-layout simulations; power 19 mW; pseudodifferential trans-impedance amplifier; short-distance high-density multichannel optical communication system; single-channel TIA; size 0.18 mum; size 75 mum; size 80 mum; Bandwidth; CMOS technology; Circuit analysis; Energy consumption; Equivalent circuits; Optical amplifiers; Optical feedback; Optical fiber communication; Optical receivers; Parasitic capacitance; active inductance; optical communication; regulated cascade; trans-impedance amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications & Signal Processing, 2009. WCSP 2009. International Conference on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-1-4244-4856-2
  • Electronic_ISBN
    978-1-4244-5668-0
  • Type

    conf

  • DOI
    10.1109/WCSP.2009.5371516
  • Filename
    5371516