Design and evaluation of integrated electromagnetic power passives with vertical surface interconnections

Author

Liu, W. ; van Wyk, J.D. ; Odendaal, W.G.

Author_Institution

Dept. of Electr. & Comput. Eng., Virginia Polytech Inst. & State Univ., Blacksburg, VA, USA

Volume

2

fYear

2004

fDate

2004

Firstpage

958

Abstract

This paper presents a symmetric planar structure with vertical surface interconnection to construct an integrated electromagnetic power passive module (IEPP), incorporating distributed inductance, capacitance and transformer action. A design procedure is proposed with specific attentions to constructional aspects, electromagnetic constraints and thermo-mechanical characteristics. Loss calculation and one-dimensional thermal modeling are studied and applied in the design. A prototype is built and tested, showing good electromagnetic performance.

Keywords

capacitors; inductors; interconnections; transformers; windings; capacitance; constructional aspects; distributed inductance; electromagnetic constraints; high-power density; integrated electromagnetic power passive module; symmetric planar structure; thermomechanical characteristics; transformer action; vertical surface interconnections; Capacitance; Conductors; Copper; Electromagnetic induction; Electromagnetic measurements; Inductance; Power electronics; Power system interconnection; Power transformer insulation; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE

Print_ISBN

0-7803-8269-2

Type

conf

DOI

10.1109/APEC.2004.1295938

Filename

1295938