DocumentCode
2950227
Title
Encapsulated Aluminum Nitride SAW devices for liquid sensing applications
Author
Tran, A.T. ; Pandraud, G. ; Moh, T.S.Y. ; Schellevis, H. ; Sarro, P.M. ; Akhnoukh, A. ; Purniawan, A.
Author_Institution
Lab. of Electron. Components, Delft Univ. of Technol. Delft, Delft, Netherlands
fYear
2012
fDate
28-31 Oct. 2012
Firstpage
1
Lastpage
4
Abstract
Very low-stress and good crystallinity Aluminum Nitride (AlN) thin films deposited on (100) Silicon substrates are optimized for surface acoustic wave (SAW) devices. We developed a simplified process to fabricate AlN SAW devices suitable for fast screening of liquid substances as needed for health and environmental monitoring. By encapsulating the interdigital transducer (IDT) with a very thin SiN layer, a sufficiently large sensing area is available between the electrodes. This allows direct and fast loading of the liquid drops on the device surface as well as cleaning, for repeated use. Moreover, the amount of layers on top of the piezoelectric AlN is minimized to avoid reduction of the signal. The fabricated devices are tested by using different buffer solutions typical in biological research (NaCl and phosphate buffered saline) and the possibility to operate these SAW devices for liquid sensors is demonstrated.
Keywords
aluminium compounds; chemical sensors; surface acoustic wave sensors; SAW devices; biological research; encapsulated aluminum nitride; interdigital transducer; liquid sensing applications; silicon substrates; Films; Liquids; Sensors; Silicon compounds; Surface acoustic wave devices; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2012 IEEE
Conference_Location
Taipei
ISSN
1930-0395
Print_ISBN
978-1-4577-1766-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2012.6411392
Filename
6411392
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