Thermal modeling of a few-chip module housing a DC-DC power supply

Author

Walshak, David ; Hashemi, Hassan ; Mehrotra, Piyush

Author_Institution

Crystal Semicond. Corp., Austin, TX, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

861

Lastpage

868

Abstract

To meet the need for future compact, efficient, high-frequency power supplies, a joint R&D effort between Harris Semiconductor and MCC was established to study the enabling technologies necessary to design a Few-Chip Module incorporating a DC-to-DC distributed power supply component set. The module consists of a Harris Power ASIC (PASIC) chip, a Schottky diode, and 12 discrete multilayer ceramic capacitors (MLCs). The package configuration discussed in this paper is a 120-lead 28×28 mm thermally-enhanced quad flat package (QFP). The package design is briefly reviewed and the thermal characterization results of the QFP implementation are discussed in detail

Keywords

application specific integrated circuits; integrated circuit modelling; integrated circuit packaging; modules; power integrated circuits; power supply circuits; thermal analysis; 28 mm; DC-DC power supply; Schottky diode; discrete multilayer ceramic capacitors; distributed power supply component set; enabling technologies; few-chip module; high-frequency power supplies; package configuration; power ASIC; thermal characterization; thermal modeling; thermally-enhanced quad flat package; Application specific integrated circuits; Capacitors; Copper; Electronic packaging thermal management; Electronics packaging; Power supplies; Schottky diodes; Substrates; Thermal resistance; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550509

Filename

550509