Title :
Thermal modeling of a few-chip module housing a DC-DC power supply
Author :
Walshak, David ; Hashemi, Hassan ; Mehrotra, Piyush
Author_Institution :
Crystal Semicond. Corp., Austin, TX, USA
Abstract :
To meet the need for future compact, efficient, high-frequency power supplies, a joint R&D effort between Harris Semiconductor and MCC was established to study the enabling technologies necessary to design a Few-Chip Module incorporating a DC-to-DC distributed power supply component set. The module consists of a Harris Power ASIC (PASIC) chip, a Schottky diode, and 12 discrete multilayer ceramic capacitors (MLCs). The package configuration discussed in this paper is a 120-lead 28×28 mm thermally-enhanced quad flat package (QFP). The package design is briefly reviewed and the thermal characterization results of the QFP implementation are discussed in detail
Keywords :
application specific integrated circuits; integrated circuit modelling; integrated circuit packaging; modules; power integrated circuits; power supply circuits; thermal analysis; 28 mm; DC-DC power supply; Schottky diode; discrete multilayer ceramic capacitors; distributed power supply component set; enabling technologies; few-chip module; high-frequency power supplies; package configuration; power ASIC; thermal characterization; thermal modeling; thermally-enhanced quad flat package; Application specific integrated circuits; Capacitors; Copper; Electronic packaging thermal management; Electronics packaging; Power supplies; Schottky diodes; Substrates; Thermal resistance; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550509
