• DocumentCode
    2950490
  • Title

    3D-TSV overview

  • Author

    Arkalgud, S.

  • fYear
    2010
  • fDate
    18-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    A collection of slides from the authors conference was given. The topics included are 3D TSV technology and supply chain.
  • Keywords
    three-dimensional integrated circuits; 3D TSV supply chain; 3D TSV technology; through-silicon-via technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Type

    conf

  • Filename
    5750184
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2950490