DocumentCode :
2950500
Title :
Relentless innovation: The case for agility in semiconductor manufacturing
Author :
Sonderman, T.
fYear :
2010
fDate :
18-20 Oct. 2010
Firstpage :
1
Lastpage :
1
Abstract :
As the market for advanced technology continues its endless march forward, the industry faces increasing challenges to sustain the current pace of innovation. Leading-edge process technology is becoming more cost-intensive, design companies are developing chips with extraordinary complexity, and the next generation technology will require an unprecedented level of performance, and cost-effectiveness to deliver on its full potential. This confluence of factors is compounded by a major global recession, which has caused many manufacturers to develop a renewed focus on short-term productivity improvements. However, there is still a critical need for manufacturers to become more agile so that they are better positioned to respond to the long-term challenges of fluctuating demands. To address this need for agility, GLOBALFOUNDRIES has developed a unique manufacturing capability, called “Automated Precision Manufacturing”, or APM. Through enhanced delivery capabilities and improved product quality, APM has enabled GLOBALFOUNDRIES to deliver cutting-edge technology at low costs, which is a critical manufacturing advantage in the fast moving semiconductor industry. This presentation will take a look at how the lean manufacturing techniques that have successfully been used to transform other industries can be leveraged to provide the agility needed in semiconductor manufacturing.
Keywords :
agile manufacturing; competitive intelligence; foundries; globalisation; innovation management; integrated circuit design; lean production; semiconductor industry; automated precision manufacturing; chip design companies; cutting-edge technology; global foundries; global recession; leading-edge process technology; next generation technology; relentless innovation; semiconductor industry; semiconductor manufacturing technique; short-term productivity improvements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5750185
Link To Document :
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