Title :
1989 Proceedings. 39th Electronic Components Conference (Cat. No.89CH2775-5)
Abstract :
The following topics are dealt with: superconductors and ceramics; polymer interconnects; connectors; polyimide materials; tape-automated bonding; discrete/semiconductor components; fatigue of solder materials; reliability test methods; optical interconnections; electrical performance of packages; reliability of interconnects; optical fiber applications; single-chip packaging; advanced substrates for hybrids; manufacturing process control and quality systems; multichip packaging; hybrid technology and MIL standard conformance; new manufacturing processes and technology; IEEE Computer Package Gel Task Force and Compliance Leaded Task Force reports; packaging; materials
Keywords :
electric connectors; fibre optics; high-temperature superconductors; hybrid integrated circuits; materials testing; microassembling; packaging; polymers; reliability; soldering; Compliance Leaded Task Force reports; IEEE Computer Package Gel Task Force; MIL standard conformance; advanced hybrid substrates; ceramics; conference; connectors; discrete/semiconductor components; hybrid technology; interconnect reliability; manufacturing process control; manufacturing technology; multichip packaging; optical fiber applications; optical interconnections; package electrical performance; packaging; polyimide materials; polymer interconnects; quality systems; reliability test methods; single-chip packaging; solder material fatigue; superconductors; tape-automated bonding;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX, USA
DOI :
10.1109/ECC.1989.77718
