Direct chip interconnect using polymer bonding

High-density, fine-pitch interconnection is now possible with polymer bonding systems. Polymer bonding methods for the direct interconnection of integrated circuit (IC) components are considered. Emerging concepts using polymer materials engineered for direct mechanical and electrical connection of ICs are covered. Polymer thick-film (PTF) technology, the earliest approach to printed circuits, has moved from the simple membrane switch arena to the more complex and demanding realm of circuitry. PTF technology, in addition to lowering cost, can relieve the high-density interconnect bottleneck. Anisotropic conductive adhesive technology, both for tape automated bonding (TAB) and flip-chip bonding strategies, is examined. The use of isotropically conductive and nonconductive polymer bonding agents for direct mechanical and electrical connection of bare die to circuit boards is also examined. Although some of these technologies remain experimental, anisotropic conductive adhesive bonding of electronic components has reached high-volume production status