Test chips for die stress characterization using arrays of CMOS sensors

Author

Bradley, A.T. ; Jaeger, R.C. ; Suhling, J.C. ; Zou, Y.

Author_Institution

Microelectron. Sci. & Technol. Center, Auburn Univ., AL, USA

fYear

1999

fDate

1999

Firstpage

147

Lastpage

150

Abstract

This paper demonstrates the use of special test chips containing arrays of CMOS FET differential pairs as mechanical stress sensors and reports the first results of measurements of packaging induced die stresses for temperatures ranging from the epoxy cure temperature (430 K) to near liquid nitrogen temperature (90 K). The experimental test chip consists of 49 CMOS stress sensor rosettes distributed across the die and interconnected by a novel scheme

Keywords

CMOS integrated circuits; arrays; electric sensing devices; integrated circuit measurement; integrated circuit packaging; integrated circuit testing; stress measurement; 90 to 430 K; CMOS FET differential pairs; CMOS sensor array; die stress characterization; epoxy cure temperature; mechanical stress sensors; near liquid nitrogen temperature; packaging induced die stresses; sensor rosettes; test chips; FETs; Mechanical sensors; Mechanical variables measurement; Semiconductor device measurement; Sensor arrays; Sensor phenomena and characterization; Stress measurement; Temperature distribution; Temperature sensors; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits, 1999. Proceedings of the IEEE 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5443-5

Type

conf

DOI

10.1109/CICC.1999.777262

Filename

777262