Title :
Test chips for die stress characterization using arrays of CMOS sensors
Author :
Bradley, A.T. ; Jaeger, R.C. ; Suhling, J.C. ; Zou, Y.
Author_Institution :
Microelectron. Sci. & Technol. Center, Auburn Univ., AL, USA
Abstract :
This paper demonstrates the use of special test chips containing arrays of CMOS FET differential pairs as mechanical stress sensors and reports the first results of measurements of packaging induced die stresses for temperatures ranging from the epoxy cure temperature (430 K) to near liquid nitrogen temperature (90 K). The experimental test chip consists of 49 CMOS stress sensor rosettes distributed across the die and interconnected by a novel scheme
Keywords :
CMOS integrated circuits; arrays; electric sensing devices; integrated circuit measurement; integrated circuit packaging; integrated circuit testing; stress measurement; 90 to 430 K; CMOS FET differential pairs; CMOS sensor array; die stress characterization; epoxy cure temperature; mechanical stress sensors; near liquid nitrogen temperature; packaging induced die stresses; sensor rosettes; test chips; FETs; Mechanical sensors; Mechanical variables measurement; Semiconductor device measurement; Sensor arrays; Sensor phenomena and characterization; Stress measurement; Temperature distribution; Temperature sensors; Testing;
Conference_Titel :
Custom Integrated Circuits, 1999. Proceedings of the IEEE 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5443-5
DOI :
10.1109/CICC.1999.777262
