DocumentCode
2951999
Title
Multi-GHz elastomeric connectors for complex hybrids and chip carriers
Author
Berg, William E.
Author_Institution
Tectronix Inc., Beaverton, OR, USA
fYear
1989
fDate
22-24 May 1989
Firstpage
50
Lastpage
70
Abstract
In attempting to achieve optimum or almost reflectionless signal transmission in gigahertz-frequency circuitry on a printed-circuit board (PCB), signal routing via microstrip transmission lines is used. However, when the conventional practice of interconnecting hybrids or chip carriers to only one plane on the PCB is followed, unwanted reflections result because the transmission line grounds are not directly connected. Elastomeric connector systems make it possible to connect signals (and grounds) of the microstrip transmission lines of a PCB directly to the microstrip transmission lines of a hybrid or VLSI chip carrier by aligning the transmission lines of the PCB and hybrid in a coplanar fashion and then accurately positioning small contacts bonded to elastomer over the aligned transmission lines. The PCB and hybrid are of the same thickness and are sandwiched between a metal head sink and the elastomeric contacts nested into the plastic frame. Contact force is applied by tightening the plastic frame into which the elastomer and its attached contacts are nested. The related microstrip transmission line ground planes are thus directly connected by the metal heat sink
Keywords
electric connectors; hybrid integrated circuits; integrated circuit technology; microwave integrated circuits; monolithic integrated circuits; packaging; printed circuit accessories; printed circuit manufacture; VLSI chip carrier; bonded elastometric contacts; chip carriers; complex hybrids; contact force; coplanar alignment; metal head sink; microstrip transmission line ground planes; microstrip transmission lines; microwave circuitry; multi-GHz elastomeric connectors; plastic frame; printed-circuit board; reflectionless signal transmission; signal routing; Connectors; Contacts; Coplanar transmission lines; Distributed parameter circuits; Integrated circuit interconnections; Microstrip; Plastics; Reflection; Routing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location
Houston, TX
Type
conf
DOI
10.1109/ECC.1989.77728
Filename
77728
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