• DocumentCode
    2952398
  • Title

    Modeling power budget requirements of implantable electronic devices

  • Author

    Hashemi, S. ; Sawan, M. ; Savaria, Y.

  • Author_Institution
    Polystim Neurotechnol. Lab., Ecole Polytech. de Montreal, Montreal, QC
  • fYear
    2005
  • fDate
    11-14 Dec. 2005
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present in this paper a new analytical, empirical and behavioral modular model developed for accurate evaluation of power dissipation in a power conversion chain dedicated to power up an electronic implantable device. The model is suitable for power estimation/planning in early design stages, to determine the contribution of each circuit module on the total power consumption and to estimate the input and output voltages of each module. The model takes into account the influence of the dynamic and static losses. The parasitic capacitances associated with charge pump stages were also considered. The model demonstrates the dependence of power on several main design parameters. It is built based on average power consumption and is coded in Verilog-A. The model is flexible and robust to changes in design parameters and provides accurate and valid results over a wide range of parameter values.
  • Keywords
    biomedical electronics; charge pump circuits; hardware description languages; prosthetics; Verilog-A; average power consumption; implantable electronic devices; parasitic capacitances; power budget requirements; power consumption; power conversion chain; power dissipation; power estimation-planning; Charge pumps; Circuits; Energy consumption; Hardware design languages; Implants; Parasitic capacitance; Power conversion; Power dissipation; Robustness; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems, 2005. ICECS 2005. 12th IEEE International Conference on
  • Conference_Location
    Gammarth
  • Print_ISBN
    978-9972-61-100-1
  • Electronic_ISBN
    978-9972-61-100-1
  • Type

    conf

  • DOI
    10.1109/ICECS.2005.4633567
  • Filename
    4633567