Flexible silicone adhesive with high electrical conductivity

Technology that couples high electrical conductivity with silicone performance characteristics suitable for electrical interconnection of substrates having a mismatch of thermal coefficients of expansion (TCE) is discussed. The silver filled silicone compositions are processed and cured in a similar manner to conventional heat-cured silicone adhesives. The resulting products are both highly flexible and highly conductive, exhibiting volume resistivities down to 2×10^-4 ohm-cm. Both flexibility and electrical conductivity are retained after extended exposure to elevated temperature. Low-temperature characterization indicates that the materials remain soft and stress-relieving down to -60°C. This combination of properties suggests that these silicone adhesives should be attractive for electrical interconnection of microelectronic substrates whose TCE mismatch would normally lead to failure due to thermomechanical stress