• DocumentCode
    2952640
  • Title

    Vmin=0.4 V LSIs are the real with silicon-on-thin-buried-oxide (SOTB) — How is the application with "Perpetuum-Mobile" micro-controller with SOTB?

  • Author

    Sugii, Nobuyuki ; Iwamatsu, Takanori ; Yamamoto, Yusaku ; Makiyama, Hideki ; Shinohara, Hirofumi ; Oda, Hidekazu ; Kamohara, Shiro ; Yamaguchi, Yoshio ; Ishibashi, Koji ; Mizutani, Tomoko ; Hiramoto, Toshiro

  • Author_Institution
    Low-power Electron. Assoc. & Project (LEAP), Tsukuba, Japan
  • fYear
    2013
  • fDate
    7-10 Oct. 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Ultralow-voltage (ULV) CMOS will be a core building block of highly energy efficient electronics. Although the near- or sub-Vth operation is effective in reducing energy per operation of CMOS circuits, its slow operation speed can miss a chance to be used in many applications. The silicon-on-thin-buried-oxide (SOTB) CMOS is a strong candidate for the ul-tralow-power (ULP) electronics because of its small variability and back-bias control. This paper describes our results on the ULV operation of SRAM and ring oscillator (RO) circuits and shows the operation speed is now sufficiently high for many ULP applications. The “Perpetuum-Mobile” micro-controllers operating at ~0.4 V are expected to be implemented in many applications such as the internet of things.
  • Keywords
    CMOS integrated circuits; SRAM chips; buried layers; large scale integration; low-power electronics; microcontrollers; silicon-on-insulator; Internet of Things; LSIs; SRAM; perrpetuum-mobile microcontroller; ring oscillator circuits; silicon-on-thin-buried-oxide; ultralow-power electronics; ultralow-voltage CMOS; voltage 0.4 V; CMOS integrated circuits; Delays; Energy efficiency; Internet; Random access memory; Silicon; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013 IEEE
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/S3S.2013.6716576
  • Filename
    6716576