DocumentCode
2952659
Title
Novel layer-by-layer silica nanoparticles as an adorbent bed for micro-fabricated preconcentrators
Author
Dong Wang ; Muhammad, Ajmal ; Heflin, J.R. ; Agah, Masoud
Author_Institution
Dept. of Phys., Virginia Tech, Blacksburg, VA, USA
fYear
2012
fDate
28-31 Oct. 2012
Firstpage
1
Lastpage
4
Abstract
This paper reports the application of SiO2 nanoparticles (NPs) as an adsorbent bed for capturing volatile organic compounds (VOCs) in a micropreconcentrator (μPC) chip for the first time. The adsorbent coating is deposited inside and on the sidewalls of the microfabricated 3D square structures using layer-by-layer (LbL) self-assembly technique. The device consists of 12mm×9mm×0.5mm chip with square pillars having 50μm side length, embedded inside an 8mm×8mm×0.24mm cavity. The LbL technique provides excellent control over the adsorbent thickness with low cost and batch fabrication ability. The deposited SiO2 NPs offer high porosity and surface area, essential for trapping VOCs. Moreover, the high temperature sustainability (800°C) proves to be vital for excellent silicon-glass anodic bonding process. In our test, μPC chip with SiO2 NPs adsorbent bed totally adsorbs xylene compound and generate a sharp desorption peak during thermal desorption process. In addition, it also shows the ability to adsorb a mixture of three compounds, which have been successfully separated and detected after desorption.
Keywords
chromatography; gas sensors; microfabrication; microsensors; nanoparticles; self-assembly; SiO2; adorbent bed; adsorbent coating; batch fabrication; layer-by-layer self-assembly technique; layer-by-layer silica nanoparticles; microfabricated 3D square structures; microfabricated preconcentrators; micropreconcentrator chip; silicon-glass anodic bonding process; size 0.24 mm; size 0.5 mm; size 12 mm; size 50 mum; size 8 mm; size 9 mm; volatile organic compounds; Coatings; Compounds; Fabrication; Materials; Nanoparticles; Surface treatment; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2012 IEEE
Conference_Location
Taipei
ISSN
1930-0395
Print_ISBN
978-1-4577-1766-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2012.6411526
Filename
6411526
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