DocumentCode :
2952812
Title :
A review of substrate coupling issues and modeling strategies
Author :
Singh, Raminderpal
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
fYear :
1999
fDate :
1999
Firstpage :
491
Lastpage :
499
Abstract :
This tutorial paper reviews the technologies behind substrate coupling and modeling. The key focuses throughout are the importance of suitable substrate models and a sufficient understanding of the substrate coupling in the circuit being designed. Discussions include Radio Frequency (RF) and Mixed-Signal (MS) designs, but also touch upon System-on-Chip (SoC). An example RF circuit is simulated with a substrate model and the effect of substrate process variations on the circuit´s performance is discussed
Keywords :
UHF integrated circuits; integrated circuit layout; integrated circuit modelling; mixed analogue-digital integrated circuits; reviews; substrates; RF designs; floorplanning; mixed-signal designs; modeling strategies; review; substrate coupling issues; substrate models; system-on-chip; Application specific integrated circuits; Conductivity; Coupling circuits; Digital signal processing; Doping profiles; Paper technology; Radio frequency; Sensor systems; Substrates; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits, 1999. Proceedings of the IEEE 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5443-5
Type :
conf
DOI :
10.1109/CICC.1999.777329
Filename :
777329
Link To Document :
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