DocumentCode :
2953033
Title :
Use of anisotropically conductive elastomers in high density separable connectors
Author :
Lambert, W.R. ; Mitchell, J.P. ; Suchin, J.A. ; Fulton, J.A.
Author_Institution :
AT&T Bell Labs., Whippany, NJ, USA
fYear :
1989
fDate :
22-24 May 1989
Firstpage :
99
Lastpage :
106
Abstract :
Tests performed on a simulated high-density, separable connector that uses a flex circuit backed by a compliant elastomer as a substrate for one set of contacts and a rigid backplane as a substrate for the other set are described. A 10-mil-thick sheet of elastomeric conductive polymer interconnect (EECPI) material was placed between the pair of contact arrays. The ECPI material is an anisotropically conductive elastomer that conducts in the Z direction only. Three types of backplane were used in the tests: a flat backplane, a backplane with a bow of 12 mil across a distance of 3 in, and a backplane with a large, randomly selected portion of the contacts raised 1.5 mil above the other contacts. The properties and other advantages of the elastomer-backed flex/ECPI combination as well as some of the problems to be overcome in the design of high-density, separable connectors incorporating this approach are discussed
Keywords :
composite materials; elastomers; electric connectors; materials testing; printed circuit accessories; 1.5 mil; 10 mil; 12 mil; 3 in; Z direction conduction; anisotropically conductive elastomers; bowed backplane; compliant elastomer; contact arrays; elastomeric conductive polymer interconnect material; flat backplane; flex circuit; high density separable connectors; randomly raised contacts backplane; rigid backplane substrate; tests; Anisotropic magnetoresistance; Backplanes; Circuit simulation; Circuit testing; Conducting materials; Connectors; Contacts; Flexible electronics; Performance evaluation; Sheet materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/ECC.1989.77734
Filename :
77734
Link To Document :
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