Title :
Polymer dielectric options for thin film packaging applications
Author :
Tessier, T.G. ; Adema, G.M. ; Turlik, I.
Author_Institution :
Bell Northern Res., Research Triangle Park, NC, USA
Abstract :
Several classes of available polyimide- and non-polyimide-based dielectrics have been recommended for use in thin-film substrates. A comprehensive survey of the commercially available materials considered for use in an advanced packaging program is presented. Critical physical properties of these candidate dielectrics are compared and related to their degree of compatibility with established thin-film processes
Keywords :
dielectric thin films; materials testing; organic insulating materials; packaging; polymer films; thin film circuits; commercially available materials; compatibility with established thin-film processes; nonpolyimide dielectrics; packaging program; physical properties; polyimide dielectrics; polymer dielectrics; survey; thin film packaging applications; thin-film substrates; Adhesives; Aluminum nitride; Conducting materials; Dielectric materials; Dielectric substrates; Dielectric thin films; Microelectronics; Packaging; Polymer films; Thin film circuits;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77738
