DocumentCode :
2953937
Title :
A 3.0–7.5 GHz CMOS UWB PA for group 1~3 MB-OFDM application using current-reused and shunt-shunt feedback
Author :
Murad, S.A.Z. ; Pokharel, Ramesh K. ; Kanaya, Haruichi ; Yoshida, Kenta
Author_Institution :
Grad. Sch. of Inf. Sci. & Electr., Kyushu Univ., Fukuoka, Japan
fYear :
2009
fDate :
13-15 Nov. 2009
Firstpage :
1
Lastpage :
4
Abstract :
The design of a 3.0-7.5 GHz UWB CMOS power amplifier (PA) for group 1~3 MB-OFDM UWB applications in TSMC 0.18-¿m CMOS technology is presented. The UWB PA proposed in this paper uses a current-reused technique to enhance the gain at the upper end of the desired band, and the resistive feedback at the second stage is used to obtain gain flatness. The shunt-shunt feedback is used to enhance bandwidth and improve output wideband matching. In addition, the cascode topology with an additional common-source stage was used to achieve high power gain. The post-layout simulation results indicated that the input return loss (S11) was less than -5 dB, output return loss (S22) was less than -7 dBm, and average gain was approximately 10 dB over the frequencies ranges of interest. The output 1-dB compression point above 0 dBm, the output third-order intercept point (OIP3) was 10 dBm, and average PAE of 12%. Moreover, an excellent phase linearity property (group delay) of ±137.7 ps across the whole band was obtained with a power consumption of 15 mW.
Keywords :
CMOS analogue integrated circuits; MMIC power amplifiers; circuit feedback; integrated circuit layout; CMOS UWB power amplifier; MB-OFDM application; current reused; frequency 3 GHz to 7.5 GHz; post layout simulation; resistive feedback; shunt-shunt feedback; third order intercept point; wideband matching; Bandwidth; CMOS technology; Delay lines; Frequency; Impedance matching; Linearity; Output feedback; Power amplifiers; Topology; Wideband; cascode; current- reused; phase linearity; power amplifier; ultra-wideband;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wireless Communications & Signal Processing, 2009. WCSP 2009. International Conference on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-4856-2
Electronic_ISBN :
978-1-4244-5668-0
Type :
conf
DOI :
10.1109/WCSP.2009.5371726
Filename :
5371726
Link To Document :
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