Title :
New low coefficient of thermal expansion polyimide for inorganic substrates
Author :
Merriman, Burt T. ; Craig, John D. ; Nader, Allan E. ; Goff, David L. ; Pottiger, Michael T. ; Lautenberger, William J.
Author_Institution :
E.I. Du Pont de Nemours & Co. Inc., Wilmington, DE, USA
Abstract :
Recent interest in using polyimides for high-density interconnect applications (HDI) in which multilayer structures are formed has created a need for polyimides that have a coefficient of thermal expansion (CTE) matched to that of the underlying substrate. A polyimide chemistry that allows for a significant lowering of the CTE and subsequent reduction of stress on silicon and ceramic substrates while giving improved dielectric constant (2.9) and water absorption properties (<1 wt.%) is reported. Characterization of the properties and processing parameters is discussed, and the results are compared with those for currently used materials
Keywords :
environmental testing; organic insulating materials; permittivity; polymer films; thermal expansion; Si substrate; ceramic substrates; dielectric constant; high-density interconnect; inorganic substrates; multilayer metallisation dielectrics; multilayer structures; permittivity; polyimide chemistry; polyimides; preparation; processing parameters; properties; thermal expansion coefficient reduction; thermal expansion matching; underlying substrate; water absorption properties; Ceramics; Chemistry; Dielectric constant; Dielectric substrates; Nonhomogeneous media; Polyimides; Silicon; Thermal expansion; Thermal stresses; Water;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77742
