Title :
Facet preparation of SOI waveguides by etching and cleaving compared to dicing and polishing
Author :
Schnarrenberger, Martin ; Zimmermann, Lars ; Mitze, Torsten ; Bruns, Jiirgen ; Petermann, Klaus
Author_Institution :
Technische Univ. Berlin, Germany
fDate :
29 Sept.-1 Oct. 2004
Abstract :
We compared two different techniques of facet preparation of silicon-on-insulator (SOI) waveguides: The conventional by dicing and polishing and our proposed by dry etching the facets and cleaving along anisotropically etched cleaving grooves.
Keywords :
etching; materials preparation; optical fabrication; optical waveguides; polishing; silicon-on-insulator; SOI waveguides; Si; anisotropically etched grooves; cleaving; cleaving grooves; dicing; dry etching; facet preparation; polishing; Dry etching; Geometrical optics; Integrated optics; Optical device fabrication; Optical devices; Optical fiber networks; Optical filters; Optical materials; Optical waveguides; Silicon;
Conference_Titel :
Group IV Photonics, 2004. First IEEE International Conference on
Print_ISBN :
0-7803-8474-1
DOI :
10.1109/GROUP4.2004.1416657
