Title :
Tapered active layer laser device performance and its impact on low cost optoelectronics
Author :
Lealman, I.F. ; MacDonald, B.M. ; Collins, J.V. ; Fiddyment, P.J. ; Jones, C.A. ; Waller, R.G. ; Robertson, M.J. ; Rivers, L.J. ; Peed, C.M. ; Cooper, K. ; Perrin, S.D. ; Nield, M.W. ; Harlow, M.J.
Author_Institution :
British Telecom Res. Labs., Ipswich, UK
Abstract :
75% coupling to cleaved single mode fibre has been obtained for a 1.55 μm tapered active strained MQW layer device. A fully packaged component using precision laser die cleaving and a silicon micro machined substrate has produced a record 55% passive coupling
Keywords :
integrated optoelectronics; optical communication equipment; optical fibre couplers; packaging; quantum well lasers; substrates; 1.55 mum; cleaved single mode fibre coupling; fully packaged component; low cost optoelectronics; passive coupling; precision laser die cleaving; silicon micro machined substrate; tapered active layer laser device performance; tapered active strained MQW layer device; Costs; Fiber lasers; Laser modes; Optical design; Optical device fabrication; Optical fiber devices; Packaging machines; Pump lasers; Semiconductor device packaging; Semiconductor lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484483
