DocumentCode
2956070
Title
Dual-Layer Cooperative Error Control for Reliable Nanoscale Networks-on-Chip
Author
Yu, Qiaoyan ; Ampadu, Paul
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
fYear
2009
fDate
7-9 Oct. 2009
Firstpage
431
Lastpage
439
Abstract
We propose a framework that allows dual-layer cooperative error control in a nanoscale network-on-chip (NoC), to simultaneously improve reliability, performance and energy efficiency. The framework combines a configurable routing algorithm in the network layer and an adaptive error control coding scheme in the datalink layer. When the network layer detects an increase in network congestion, either the routing algorithm is switched from deterministic to partially adaptive routing or the error controls schemes is adjusted to a powerful mode. In high noise conditions, the adaptive error control in the datalink layer is switched to a more powerful error control mode, cooperating with the configurable routing algorithm. The resulting dual-layer framework allows reliability and network congestion to be managed dynamically. Simulation results show that the proposed method improves the average latency up to 24% and the average energy up to 27% compared to the single layer error control, with 8% area overhead.
Keywords
VLSI; integrated circuit noise; integrated circuit reliability; network-on-chip; VLSI; adaptive error control; adaptive error control coding scheme; average energy; average latency; configurable routing algorithm; datalink layer; dual-layer cooperative error control; energy efficiency; nanoscale networks-on-chip reliability; network congestion; noise conditions; routing algorithm; Adaptive control; Computer network reliability; Crosstalk; Error correction; Fault tolerant systems; Network-on-a-chip; Programmable control; Routing; System-on-a-chip; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 2009. DFT '09. 24th IEEE International Symposium on
Conference_Location
Chicago, IL
ISSN
1550-5774
Print_ISBN
978-0-7695-3839-6
Type
conf
DOI
10.1109/DFT.2009.48
Filename
5372226
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