Title :
3-D integration of MQW SEED detectors and modulators over active sub-micron CMOS circuits: Application to a 2KBit parallel photonic page buffer
Author :
Krishnamoorthy, A.V. ; Ford, J.E. ; Goossen, K.W. ; Walker, J.A. ; Lentine, A.L. ; Woodward, T.K. ; Asaro, L. A D ; Hui, S.P. ; Tseng, B. ; Leibenguth, R. ; Kossives, D. ; Dahringe, D. ; Chirovsky, L.M.F. ; Kiamilev, F.E. ; Aplin, G.F. ; Rozie, R.G. ; Mil
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
Abstract :
The efficacy of many system-designs based on free-space optical interconnects and smart-pixels, depends on the availability of a flexible, high-density, silicon-compatible, optoelectronic technology platform. To this end, we demonstrate the hybrid 3D integration of GaAs-AlGaAs 850nm multiple quantum well (MQW) detectors and modulators directly over active 0.8 μm silicon CMOS circuits. To test this technique, a self electro-optic effect device (SEED) input-light detector was flip-chip bonded over a transimpedance receiver circuit, whose output was fed to a simple transmitter circuit and then to another SEED device that served as an output-light modulator
Keywords :
CMOS integrated circuits; III-V semiconductors; SEEDs; aluminium compounds; electro-optical modulation; flip-chip devices; gallium arsenide; infrared detectors; integrated optoelectronics; optical receivers; photodetectors; semiconductor quantum wells; 0.8 mum; 2KBit parallel photonic page buffer; 3-D integration; 850 nm; GaAs-AlGaAs; MQW SEED detectors; MQW modulators; SEED input-light detector; active 0.8 μm silicon CMOS circuits; active sub-micron CMOS circuits; flexible high-density silicon-compatible optoelectronic technology platform; flip-chip bonded; free-space optical interconnects; hybrid 3D integration; output-light modulator; self electro-optic effect device; smart-pixels; system-designs; transimpedance receiver circuit; Automatic testing; Bonding; CMOS technology; Circuit testing; Detectors; Electrooptic devices; Optical interconnections; Optical transmitters; Quantum well devices; Silicon;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484515
