• DocumentCode
    2956221
  • Title

    Resilience Challenges for Exascale Systems

  • Author

    Jouppi, Norman P.

  • fYear
    2009
  • fDate
    7-9 Oct. 2009
  • Firstpage
    379
  • Lastpage
    379
  • Abstract
    The combination of decreasing device reliability due to deep submicron scaling, increasing integration, and the size of future exascale high-performance computers and cloud datacenters pose significant challenges for system resilience. Furthermore, with power and cost being of critical importance, resilience must be provided efficiently and economically. Although providing resilience will require a range of approaches at all levels of the system stack, the final responsibility rests at the system level. In addition to highlighting challenges, this talk reviews and introduces promising system-level techniques such as configurable isolation, duplication caching, multicore DIMMs, CoVeRT, and 3D checkpointing.
  • Keywords
    computer centres; scaling circuits; semiconductor device reliability; 3D checkpointing; CoVeRT; cloud datacenters; configurable isolation; deep submicron scaling; device reliability; duplication caching; exascale high-performance computers; multicore DIMM; system level techniques; system resilience; CMOS technology; Cloud computing; Computer architecture; Fault tolerant systems; Microprocessors; Power system reliability; Resilience; Technological innovation; Timing; Very large scale integration; Resilience; checkpointing; duplication; exascale systems; isolation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 2009. DFT '09. 24th IEEE International Symposium on
  • Conference_Location
    Chicago, IL
  • ISSN
    1550-5774
  • Print_ISBN
    978-0-7695-3839-6
  • Type

    conf

  • DOI
    10.1109/DFT.2009.52
  • Filename
    5372234