Thermal structure design for enhanced heat spreading in 3D ICs

Author

Jinwoo Jeong ; Seonghun Jang ; Woongkyu Choi ; Youngjae Kim ; Kukjin Chun

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea

fYear

2013

fDate

17-19 April 2013

Firstpage

544

Lastpage

547

Abstract

The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm² and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.

Keywords

finite element analysis; thermal management (packaging); three-dimensional integrated circuits; 3D IC; finite element method simulation tool; heat path; heat spreader; heat spreading enhancement; reference stacked chips; size 50 mum; thermal management; thermal structure design; thermal vias; three-layers-stacked chips; Analytical models; Heating; Integrated circuit modeling; Solid modeling; Temperature distribution; Thermal conductivity; Thermal management; 3D IC; heat path; heat spreader; thermal management; thermal via;

fLanguage

English

Publisher

ieee

Conference_Titel

TENCON Spring Conference, 2013 IEEE

Conference_Location

Sydney, NSW

Print_ISBN

978-1-4673-6347-1

Type

conf

DOI

10.1109/TENCONSpring.2013.6584504

Filename

6584504