Title :
Thermal structure design for enhanced heat spreading in 3D ICs
Author :
Jinwoo Jeong ; Seonghun Jang ; Woongkyu Choi ; Youngjae Kim ; Kukjin Chun
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Abstract :
The high efficient thermal structures are designed to resolve the heat problems in 3D ICs. The three-layers-stacked chips with the area of 10×10mm2 and the thickness of 50μm are analyzed using the finite element method simulation tool. The heat spreaders, thermal vias, and heat paths are applied to the reference stacked chips for the thermal management. The suggested thermal structure shows the results of the temperature drop of the hotspots up to 8.4°C and the reduction of the temperature gradient by 20 to 30%.
Keywords :
finite element analysis; thermal management (packaging); three-dimensional integrated circuits; 3D IC; finite element method simulation tool; heat path; heat spreader; heat spreading enhancement; reference stacked chips; size 50 mum; thermal management; thermal structure design; thermal vias; three-layers-stacked chips; Analytical models; Heating; Integrated circuit modeling; Solid modeling; Temperature distribution; Thermal conductivity; Thermal management; 3D IC; heat path; heat spreader; thermal management; thermal via;
Conference_Titel :
TENCON Spring Conference, 2013 IEEE
Conference_Location :
Sydney, NSW
Print_ISBN :
978-1-4673-6347-1
DOI :
10.1109/TENCONSpring.2013.6584504
