Title :
Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding
Author :
Sasaki, Junichi ; Honmou, Hiroshi ; Itoh, Masataka ; Uda, Akihiro ; Torikai, Toshitaka
Author_Institution :
Functional Devices Res. Labs., NEC Corp., Kawasaki, Japan
Abstract :
Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of ±1 μm has been achieved
Keywords :
flip-chip devices; modules; optical fibre couplers; reflow soldering; semiconductor lasers; AuSn; alignment-free module assembly; flip-chip bonding; laser diode modules; punching method; reflow soldered; self-aligned assembly technology; single-mode optical fiber; stripe-type AuSn solder bump; Assembly; Bonding; Costs; Diode lasers; Laboratories; Optical devices; Optical films; Optical receivers; Optical transmitters; Punching;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484848
