• DocumentCode
    2956922
  • Title

    Power management in high-level design

  • Author

    Ferguson, France ; Chen, Ben ; Mauskar, Ashutosh

  • Author_Institution
    Synopsys Inc., USA
  • fYear
    1996
  • fDate
    21-24 Oct 1996
  • Firstpage
    357
  • Lastpage
    363
  • Abstract
    Power is significant concern for any application that distinguishes itself by battery life (e.g., pagers, cellular phones, etc.), but this is not the only power sensitive market. Power management is just as critical for today´s ASIC and IC designers in nearly every market segment. Consider the following: Increased power increases electromigration and reduces reliability in long-life-cycle telecom products. Adding heat sinks or moving from plastic to ceramic packaging significantly increases the cost per unit in high volume´ chips. In deep-submicron design, increasing complexity and higher clock frequencies result in higher power consumption. There are many opportunities in the design process for designers to reduce power consumption. Following is an overview of how designers can reduce power consumption throughout the design process using power analysis and optimization
  • Keywords
    VLSI; application specific integrated circuits; high level synthesis; integrated circuit design; integrated circuit packaging; integrated circuit reliability; ASIC; deep-submicron design; design process; electromigration; heat sinks; high-level design; long-life-cycle telecom products; packaging; power analysis; power consumption; power management; reliability; Application specific integrated circuits; Batteries; Cellular phones; Electromigration; Energy consumption; Energy management; Heat sinks; Plastics; Process design; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 1996., 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    7-5439-0940-5
  • Type

    conf

  • DOI
    10.1109/ICASIC.1996.562827
  • Filename
    562827