DocumentCode
2956922
Title
Power management in high-level design
Author
Ferguson, France ; Chen, Ben ; Mauskar, Ashutosh
Author_Institution
Synopsys Inc., USA
fYear
1996
fDate
21-24 Oct 1996
Firstpage
357
Lastpage
363
Abstract
Power is significant concern for any application that distinguishes itself by battery life (e.g., pagers, cellular phones, etc.), but this is not the only power sensitive market. Power management is just as critical for today´s ASIC and IC designers in nearly every market segment. Consider the following: Increased power increases electromigration and reduces reliability in long-life-cycle telecom products. Adding heat sinks or moving from plastic to ceramic packaging significantly increases the cost per unit in high volume´ chips. In deep-submicron design, increasing complexity and higher clock frequencies result in higher power consumption. There are many opportunities in the design process for designers to reduce power consumption. Following is an overview of how designers can reduce power consumption throughout the design process using power analysis and optimization
Keywords
VLSI; application specific integrated circuits; high level synthesis; integrated circuit design; integrated circuit packaging; integrated circuit reliability; ASIC; deep-submicron design; design process; electromigration; heat sinks; high-level design; long-life-cycle telecom products; packaging; power analysis; power consumption; power management; reliability; Application specific integrated circuits; Batteries; Cellular phones; Electromigration; Energy consumption; Energy management; Heat sinks; Plastics; Process design; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 1996., 2nd International Conference on
Conference_Location
Shanghai
Print_ISBN
7-5439-0940-5
Type
conf
DOI
10.1109/ICASIC.1996.562827
Filename
562827
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