300 mm evaluation activities in Selete

Author

Fujiwara, Keiji

Author_Institution

Semicond. Leading Edge Technol., Yokohama, Japan

fYear

1998

fDate

23-26 Mar 1998

Firstpage

1

Lastpage

5

Abstract

300 mm equipment and materials are being developed in order to start IC mass production with 300 mm wafers in the year 2000. Semiconductor Leading Edge Technologies (Selete) has been evaluating and improving these technologies to complete mass production-type equipment development. The 300 mm fabrication facility plan, equipment development plan and wafer production plan are shown. The evaluation status of some machines is described, along with the issues which must be improved

Keywords

integrated circuit design; integrated circuit manufacture; integrated circuit technology; manufacturing resources planning; IC mass production; Selete; Semiconductor Leading Edge Technologies; equipment development plan; fabrication facility plan; machine evaluation status; mass production-type equipment development; wafer equipment; wafer materials; wafer production plan; wafer size; Acceleration; Costs; Inspection; Joining materials; Large-scale systems; Lead compounds; Mass production; Productivity; Semiconductor materials; Transportation;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 1998. ICMTS 1998., Proceedings of the 1998 International Conference on

Conference_Location

Kanazawa

Print_ISBN

0-7803-4348-4

Type

conf

DOI

10.1109/ICMTS.1998.688022

Filename

688022