• DocumentCode
    2956952
  • Title

    Flip-Flop Hardening and Selection for Soft Error and Delay Fault Resilience

  • Author

    Chen, Mingjing ; Orailoglu, Alex

  • Author_Institution
    CSE Dept., UC San Diego, La Jolla, CA, USA
  • fYear
    2009
  • fDate
    7-9 Oct. 2009
  • Firstpage
    49
  • Lastpage
    57
  • Abstract
    The traditional test model of go/no-go testing being questioned by increasing delay fault manifestations has become even further challenged as a result of unpredictable soft errors. Consequent probabilistic fault manifestations shift the focus to fault resilience mechanisms and tradeoffs of false alarms vs. escapes. Fault manifestation at flip-flops necessitates solutions that rely on their hardening, possibly imposing inordinate cost as flip-flops constitute a significant fraction of current designs. A two-pronged approach for resolving this challenge is necessitated, consisting of frugal flip-flop designs, capable of withstanding such faults, and an economic rationalization model to enable a prioritized flip-flop selection within an overall design budget. In this paper, we propose a hardened flip-flop that increases circuit tolerance to soft errors and delay faults simultaneously and the associated selective hardening scheme guided by a unified quality evaluation framework. The proposed flip-flop supersedes previous research efforts and simulation results show that the outlined framework delivers yield recovery and FIT reduction at a minimized hardware cost.
  • Keywords
    flip-flops; logic design; logic testing; delay fault manifestations; delay fault resilience; economic rationalization model; frugal flip-flop designs; go/no-go testing; probabilistic fault manifestations; soft error; Circuit faults; Circuit testing; Costs; Delay; Fault tolerance; Fault tolerant systems; Flip-flops; Resilience; System testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 2009. DFT '09. 24th IEEE International Symposium on
  • Conference_Location
    Chicago, IL
  • ISSN
    1550-5774
  • Print_ISBN
    978-0-7695-3839-6
  • Type

    conf

  • DOI
    10.1109/DFT.2009.50
  • Filename
    5372275