DocumentCode
295731
Title
Picosecond lifetime and high resistivity in As or Ga implanted GaAs: an alternative material for fast optoelectronic applications
Author
Tan, H.H. ; Jagadish, C. ; Kaminska, M. ; Jasinski, J. ; Krotkus, A. ; Marcinkevicius, S.
Author_Institution
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
Volume
1
fYear
1995
fDate
30-31 Oct 1995
Firstpage
345
Abstract
In this work, we report an alternative method of obtaining highly non-stoichiometric GaAs layers by implanting semi-insulating GaAs with high doses of As or Ga ions. The implanted samples were then annealed in the temperature range of 300-800°C. At the temperatures of 500-600°C, properties similar to that of low temperature LT-GaAs can be achieved. Beside providing an alternative material comparable to LT-GaAs, ion-implantation has advantages over epitaxial technique in terms of device fabrication. Ion implantation allows precise control over the incorporation of implanted ions on selected areas of the wafer. Furthermore, ion implantation provides a simple and cost effective way of device fabrication as it is compatible to the current planar fabrication technology
Keywords
annealing; arsenic; carrier lifetime; electrical conductivity; gallium; gallium arsenide; high-speed optical techniques; integrated optoelectronics; ion implantation; optical fabrication; 300 to 800 C; 500 to 600 C; As implanted GaAs; Ga implanted GaAs; GaAs; GaAs:Ga,As; alternative material; annealed; device fabrication; epitaxial technique; high doses; high resistivity; highly non-stoichiometric GaAs layers; ion-implantation; picosecond lifetime; planar fabrication technology; semi-insulating GaAs; temperature range; Annealing; Capacitive sensors; Charge carrier lifetime; Conductivity; Fabrication; Gallium arsenide; Ion implantation; Photoconducting materials; Physics; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-2450-1
Type
conf
DOI
10.1109/LEOS.1995.484900
Filename
484900
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