• DocumentCode
    2957720
  • Title

    Nanostructured aluminium-diamond composites for thermal management applications

  • Author

    Khalid, F.A. ; Beffort, O. ; Klotz, U.E. ; Gasse, P.

  • Author_Institution
    Fac. of Metall. & Mater. Eng., GIK Inst. of Eng. Sci. & Technol., Topi, Pakistan
  • fYear
    2003
  • fDate
    8-9 Dec. 2003
  • Firstpage
    462
  • Lastpage
    465
  • Abstract
    The nanostructure and morphology of Al-diamond composite material produced by pressurised liquid metal infiltration have been studied. These composites may have the potential for applications in the thermal management and electronic packaging industry. The composite samples produced by using nanosized diamond powder were examined by using advanced analytical techniques. It was demonstrated that the liquid metal infiltration technique was suitable for the production of Al-diamond composites. The samples revealed more uniform dispersion of diamond particles. Occasionally plate-shaped Al4C3 particles formed at the interface between Al and diamond particles were also detected. It can be suggested that these carbides may have formed in association with the ultra-thin amorphous graphite layer at the interfacial region.
  • Keywords
    aluminium; cooling; diamond; melt infiltration; nanocomposites; particle reinforced composites; thermal management (packaging); Al-C; Al-diamond composite material; Al4C3; carbides; electronic packaging industry; interfacial region; morphology; nanosized diamond powder; nanostructure; nanostructured aluminium-diamond composites; plate-shaped Al4C3 particles; precipitates; pressurised liquid metal infiltration; thermal management applications; ultra-thin amorphous graphite layer; uniform dispersion; Composite materials; Electronic packaging thermal management; Electronics industry; Electronics packaging; Morphology; Nanocomposites; Powders; Production; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi Topic Conference, 2003. INMIC 2003. 7th International
  • Print_ISBN
    0-7803-8183-1
  • Type

    conf

  • DOI
    10.1109/INMIC.2003.1416771
  • Filename
    1416771