Volatile species from conductive die attach adhesives

An investigation of microelectronic conductive die attach adhesives to determine the volatile species that evolve during cure and after postcure processing, such as preseal bakeout and burn-in, is described, and the results are presented and discussed. Gas chromatography/mass spectrometry was used to measure the volatile species, and complementary thermal analysis measurements were also obtained. The adhesives investigated were Adlebond 84-1LMINB1, Emerson and Cuming C-868-1, and Epo-tek H35-175MP, all silver-loaded epoxies used for electrically conductive component attachment. A comparison with previous mass spectrometry results shows that the sensitivity of the combined method is much higher, especially for higher molecular weight molecules, and that the identification of the outgassing species is simplified