DocumentCode
2958970
Title
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)
fYear
2000
fDate
3-3 Oct. 2000
Abstract
The following topics were dealt with: systems-specific packaging; packaging modelling; semiconductor packaging trends; package reliability; package assembly; flip-chip array packaging; manufacturing optimisation; and environmental factors
Keywords
assembling; environmental factors; flip-chip devices; modelling; packaging; reliability; environmental factors; flip-chip array packaging; manufacturing optimisation; package assembly; package reliability; packaging modelling; semiconductor packaging trends; systems-specific packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International
Conference_Location
Santa Clara, CA, USA
ISSN
1089-8190
Print_ISBN
0-7803-6482-1
Type
conf
DOI
10.1109/IEMT.2000.910701
Filename
910701
Link To Document