DocumentCode :
2958970
Title :
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146)
fYear :
2000
fDate :
3-3 Oct. 2000
Abstract :
The following topics were dealt with: systems-specific packaging; packaging modelling; semiconductor packaging trends; package reliability; package assembly; flip-chip array packaging; manufacturing optimisation; and environmental factors
Keywords :
assembling; environmental factors; flip-chip devices; modelling; packaging; reliability; environmental factors; flip-chip array packaging; manufacturing optimisation; package assembly; package reliability; packaging modelling; semiconductor packaging trends; systems-specific packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International
Conference_Location :
Santa Clara, CA, USA
ISSN :
1089-8190
Print_ISBN :
0-7803-6482-1
Type :
conf
DOI :
10.1109/IEMT.2000.910701
Filename :
910701
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2958970
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