DocumentCode
2958992
Title
Photochemically processed glass-ceramic optical interconnects
Author
Williams, G.E. ; Sachenik, P.A. ; Plawsky, J.L.
Author_Institution
Corning Glass Works, NY, USA
fYear
1989
fDate
22-24 May 1989
Firstpage
359
Lastpage
361
Abstract
The use of a photochemically processed glass-ceramic material, Fotoform, as a substrate for making optical-fiber-array interconnects for computer applications is discussed. The material is shown to be patternable with accuracies that approach that of single-crystal silicon. Results indicate that Fotoform has several advantages over silicon in that it is less brittle, can easily accommodate fibers, and can be assembled using ultraviolet-curable epoxies. Results for producing single-component arrays of from 6 to 32 multimode fibers are presented
Keywords
integrated optoelectronics; optical fibres; optical interconnections; Fotoform; brittle; computer applications; glass-ceramic optical interconnects; optical-fiber-array interconnects; single-component arrays; substrate; ultraviolet-curable epoxies; Distributed parameter circuits; Holographic optical components; Holography; Integrated circuit interconnections; Optical fibers; Optical interconnections; Optical materials; Photochemistry; Power transmission lines; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location
Houston, TX
Type
conf
DOI
10.1109/ECC.1989.77772
Filename
77772
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