• DocumentCode
    2958992
  • Title

    Photochemically processed glass-ceramic optical interconnects

  • Author

    Williams, G.E. ; Sachenik, P.A. ; Plawsky, J.L.

  • Author_Institution
    Corning Glass Works, NY, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    359
  • Lastpage
    361
  • Abstract
    The use of a photochemically processed glass-ceramic material, Fotoform, as a substrate for making optical-fiber-array interconnects for computer applications is discussed. The material is shown to be patternable with accuracies that approach that of single-crystal silicon. Results indicate that Fotoform has several advantages over silicon in that it is less brittle, can easily accommodate fibers, and can be assembled using ultraviolet-curable epoxies. Results for producing single-component arrays of from 6 to 32 multimode fibers are presented
  • Keywords
    integrated optoelectronics; optical fibres; optical interconnections; Fotoform; brittle; computer applications; glass-ceramic optical interconnects; optical-fiber-array interconnects; single-component arrays; substrate; ultraviolet-curable epoxies; Distributed parameter circuits; Holographic optical components; Holography; Integrated circuit interconnections; Optical fibers; Optical interconnections; Optical materials; Photochemistry; Power transmission lines; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components Conference, 1989. Proceedings., 39th
  • Conference_Location
    Houston, TX
  • Type

    conf

  • DOI
    10.1109/ECC.1989.77772
  • Filename
    77772