Title :
Life prediction of BGA and CSP assemblies using an experimental degradation law and FEM simulations
Author :
Deletage, J.-Y. ; Fremont, H. ; Louis, P. ; Danto, Y. ; Plano, B. ; Carbonne, B. ; Salagoity, M. ; Faure, C.
Author_Institution :
Bordeaux I Univ., Talence, France
Abstract :
BGA and CSP packages are now commonly used because of their capabilities to provide more I/O connections than standard leaded SMT components for the same surface. To evaluate the reliability of assemblies using these packages, we propose a life prediction method: it uses a degradation law based on experimental analyses of the evolution of the eutectic microstructure under thermal cycling, and 3D FEM simulations used to determine the maximum strain in the solder joint. The results are compared with an analytical model that provides a fast classification of different assemblies with regard to their thermomechanical behavior
Keywords :
ball grid arrays; chip scale packaging; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit testing; soldering; stress analysis; thermal stresses; 3D FEM simulation; BGA assemblies; BGA packages; CSP assemblies; CSPs; FEM simulations; I/O connections; assembly classification; degradation law; eutectic microstructure evolution; life prediction; life prediction method; maximum strain; reliability; solder joint; standard leaded SMT components; surface area; thermal cycling; thermomechanical behavior; Analytical models; Assembly; Capacitive sensors; Chip scale packaging; Lead; Microstructure; Prediction methods; Predictive models; Surface-mount technology; Thermal degradation;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-6482-1
DOI :
10.1109/IEMT.2000.910711
