Title :
Multi-chip module technology
Author_Institution :
AT&T Bell Labs., Princeton, NJ, USA
Abstract :
Multi-Chip Modules (MCMs) are typically composed of complex devices mounted into single dense packages. Most MCMs today are used either in high performance systems, including mainframes and telecommunication equipment, or are placed in miniaturization driven applications, such as portable computers, consumer products, and personal communicators. Complex parallel processing products based on neural networks are natural candidates for the MCM technology. As is the case with any state-of-the-art solution adopters, MCM technology users must become familiar with multi-disciplinary aspects of this technology. This paper introduces today´s MCM technology, and analyzes a number of these aspects, emphasizing on fundamentals of MCM manufacturing
Keywords :
integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; microassembling; multichip modules; reviews; MCM manufacturing; MCMs; assembly; complex parallel processing products; miniaturization driven applications; multi-chip module technology; neural networks; single dense packages; structured testability; Application software; Assembly; CMOS technology; Consumer products; Costs; Integrated circuit technology; Integrated circuit testing; Manufacturing; Neural networks; Packaging machines; Parallel processing; Portable computers; Pulp manufacturing; Substrates; Surface-mount technology;
Conference_Titel :
Neural Networks, 1995. Proceedings., IEEE International Conference on
Conference_Location :
Perth, WA
Print_ISBN :
0-7803-2768-3
DOI :
10.1109/ICNN.1995.488084