Title :
New SMD ball pins designed for power
Author :
Ehrman, Barry A. ; Balocco, Didier ; Gall, Antoine Le
Author_Institution :
Saft Power Syst., Green
fDate :
Sept. 30 2007-Oct. 4 2007
Abstract :
In this paper, we will present information on a new type of SMD termination using balls. In contrast to the solder balls used in low-power BGA applications for silicon packaging, the balls used for these DC-DC converters are rigid metal, plated to accept an optimum solder coating. We will analyze key parameters for these ball terminations such as co-planarity, positioning, soldering results and reliability, and compare them to more commonly used types of SMD pins.
Keywords :
DC-DC power convertors; ball grid arrays; soldering; surface mount technology; DC-DC converters; SMD ball pins; SMD termination; low-power BGA applications; optimum solder coating; rigid metal; silicon packaging; solder balls; surface mount devices; Assembly; Copper; DC-DC power converters; Environmentally friendly manufacturing techniques; Lead; Pins; Power systems; Soldering; Springs; Tin;
Conference_Titel :
Telecommunications Energy Conference, 2007. INTELEC 2007. 29th International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-1627-1
Electronic_ISBN :
978-1-4244-1628-8
DOI :
10.1109/INTLEC.2007.4448790
