DocumentCode
2961794
Title
Design methodology of high frequency ultrasonic transducer for wire bonding
Author
Zhao, Xingyu ; Wang, Fujun ; Zhang, Dawei
Author_Institution
Sch. of Mech. Eng., Tianjin Univ., Tianjin
fYear
2008
fDate
5-8 Aug. 2008
Firstpage
1000
Lastpage
1005
Abstract
A methodology is put forward for the design of high frequency ultrasonic transducer for wire bonding, which is based on the theory of the ultrasonic transducer, finite element method (FEM) and impedance analysis techniques. The axial vibration equation of the bar with varied section, piezoelectric equation and mechanical boundary conditions are used to conceive and design the transducer. Using the FEM, the piezoelectric converter and the ultrasonic horn are optimized respectively based the dynamic analysis, and the optimization model of the transducer is achieved finally. The mode and harmonic response analysis of the piezoelectric converter, ultrasonic horn and the transducer is clearly identified and carefully analyzed. And the influence of each feature of the ultrasonic transducer, such as the geometry, preloaded bolt mounting torque and the flange placement, to the mode scattering and transducer end response is discussed thoroughly. In order to research on the vibration characteristic of the transducer accurately, the piezoelectric element solid5 is used to define the piezoelectric ceramics. The piezoelectric property of the piezoelectric ceramics could be defined through the dielectric constant matrix, piezoelectric constant matrix and elasticity constant matrix. And the element PRETS179 is used to simulate the preload of the bolt. The prototyped transducer is tested through the impedance analysis, which proves the resemblance with the theory and FEM analysis.
Keywords
finite element analysis; lead bonding; ultrasonic transducers; axial vibration equation; dielectric constant matrix; finite element method; high frequency ultrasonic transducer; impedance analysis techniques; mechanical boundary conditions; piezoelectric ceramics; piezoelectric constant matrix; prototyped transducer; wire bonding; Bonding; Design methodology; Equations; Frequency; Harmonic analysis; Impedance; Piezoelectric transducers; Ultrasonic transducers; Vibrations; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
Conference_Location
Takamatsu
Print_ISBN
978-1-4244-2631-7
Electronic_ISBN
978-1-4244-2632-4
Type
conf
DOI
10.1109/ICMA.2008.4798895
Filename
4798895
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