Title :
Index-matching elastomers for fiber optics
Author :
Filas, Robert W. ; Johnson, B.H. ; Wong, C.P.
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Abstract :
Silicone elastomers prepared to match the index of refraction of the core of an optical fiber are discussed. The system is composed of a vinyl-terminated dimethyldiphenylsiloxane copolymer crosslinked with tri- or tetrafunctional silanes in the presence of a chloroplatinic acid catalyst. The refractive index of the copolymer was determined as a function of diphenyl content and temperature. By measuring the reflected power from the end of a single-mode optical fiber whose end had been encapsulated in elastomer it was found that a copolymer with 15% diphenyl content crosslinked with 1,3-diphenyl-1,1,3,3-tetrakis(dimethylsiloxy)disiloxane with a hydride/vinyl stoichiometry of unity provides a perfect index match at about 30°C. Environmental testing under 85/85 conditions has shown the material to be capable of protecting biased p-i-n devices for more than 5000 h. Some other advantages of the system are that it is relatively nontoxic, environmentally stable, and can be easily cured at temperatures below 120°C
Keywords :
elastomers; environmental testing; nuclear magnetic resonance; optical fibres; polymer blends; refractive index; silicones; 1,3-diphenyl-1,1,3,3-tetrakis(dimethylsiloxy)disiloxane; 30 degC; 5000 h; NMR spectrum; biased p-i-n devices; chloroplatinic acid catalyst; environmental testing; hydride/vinyl stoichiometry; index matching elastomers; refractive index; silicone elastomers; single-mode optical fiber; tetrafunctional silanes; thermal curing; trifunctional silanes; vinyl-terminated dimethyldiphenylsiloxane copolymer; Extraterrestrial measurements; Magnetic materials; Optical attenuators; Optical fibers; Optical materials; Optical refraction; Power measurement; Protection; Refractive index; Temperature measurement;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77794