DocumentCode
2963331
Title
IEEE 2007 International Interconnect Technology Conference
fYear
2007
fDate
4-6 June 2007
Abstract
The following topics are dealt with: metallization; integration; systems; reliability/contact; and new concepts.
Keywords
electromigration; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit technology; 3D integration; IC technology; electromigration; interconnect technology; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
International Interconnect Technology Conference, IEEE 2007
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-1069-X
Electronic_ISBN
1-4244-1070-3
Type
conf
DOI
10.1109/IITC.2007.382323
Filename
4263635
Link To Document