Integrity of ceramic packages upon liquid nitrogen cycling

Author

Tong, Ho-Ming ; Yeh, Helen L. ; Goldblatt, Ronald D. ; Srivastava, Kamalesh K. ; Coffin, Jeffrey T. ; Rosenberg, William D. ; Jaspal, Jasvir S.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

1989

fDate

22-24 May 1989

Firstpage

539

Lastpage

543

Abstract

The integrity of two types of test packages (A and B) during cycling between 30°C and liquid nitrogen temperature (-196°C) is discussed. Type-A packages had polyimide-insulated chips and were characterized by higher thermal shear strain amplitudes (⩽3.3%) than type-B packages, which contained quartz-insulated chips. For either type of packages, the chips were joined to the metallized ceramic substrate using the C4 solder (Pb-Sn) technology. Solder lifetime modeling and the solder fracture/cracking mechanism are discussed. No sign of fracture or delamination of the chip insulation was observed for either package type. The important features and conclusions of the study are summarized. The results indicate the potential of the packages for liquid nitrogen operation

Keywords

ceramics; integrated circuit technology; packaging; soldering; thermal stress cracking; -196 to 30 C; C4 solder technology; PbSn solder; ceramic package integrity; liquid N cycling; metallized ceramic substrate; polyimide-insulated chips; quartz-insulated chips; solder fracture/cracking mechanism; solder lifetime modelling; test packages; thermal shear strain amplitudes; Capacitive sensors; Ceramics; Insulation; Intermetallic; Nitrogen; Packaging; Polyimides; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77802

Filename

77802