A series of demonstrators to assess technologies for silicon hybrid multichip modules

In order to exploit the full advantages of today´s high-density, high-speed, high I/O count VLSI devices, an advanced interconnect technology is required. One such technology is that of silicon hybrid multichip modules (MCMs). The advantages of using silicon as a hybrid substrate is illustrated through a series of process and functional demonstrators. The use of the demonstrators to investigate the various technologies available for chip-attach and substrate-interconnect fabrication is discussed