Title :
Densification of Carbon Nanotube Bundles for Interconnect Application
Author :
Liu, Z. ; Bajwa, N. ; Ci, L. ; Lee, S.H. ; Kar, S. ; Ajayan, P.M. ; Lu, J.-Q.
Author_Institution :
Rensselaer Polytech. Inst., Troy
Abstract :
We demonstrated a post-growth processing method to increase the site density of carbon nanotube (CNT) bundles, a critical step towards CNT interconnect for use in future ICs. CVD-grown CNT bundles are immersed in an organic solvent, then withdrawn from the liquid bath by solvent evaporation, and consequently compacted. The CNT site density is increased 5~25 times. Influences of bundle structure parameters on densification are discussed and the interconnect implementation of densified CNTs is presented.
Keywords :
carbon nanotubes; chemical vapour deposition; densification; integrated circuit interconnections; nanotechnology; C; CNT interconnect; CVD-grown CNT bundles; carbon nanotube bundle densification; organic solvent; post-growth processing method; solvent evaporation; Ballistic transport; Carbon nanotubes; Copper; Current density; Electromigration; Gold; Iron; Resists; Scanning electron microscopy; Solvents;
Conference_Titel :
International Interconnect Technology Conference, IEEE 2007
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-1069-X
Electronic_ISBN :
1-4244-1070-3
DOI :
10.1109/IITC.2007.382389
