Three-axis MEMS inertial sensor for automobile applications

Author

Jeong, Heewon ; Yamanaka, Kiyoko ; Goto, Yasushi ; Aono, Takanori ; Hayashi, Masahide

Author_Institution

Central Res. Lab., Hitachi Ltd., Tokyo, Japan

fYear

2011

fDate

28-31 Oct. 2011

Firstpage

444

Lastpage

447

Abstract

A three-axis microelectromechanical systems (MEMS) inertial sensor measuring two-axis acceleration and angular rate (rotation) has been developed for an electronic stability control (ESC) system for automobiles. We combined the angular rate detection part with the two-axis acceleration detection parts on a single MEMS chip to miniaturize the sensor. The two detection parts were designed to work under different environmental pressures through a two-step wafer level package (WLP) process to achieve the required sensitivity for the gyroscope with excellent vibration immunity for the accelerometers. We report on the design concept and test results of the three-axis MEMS inertial combined sensor and the manufacturing processes of the two-step WLP and through-silicon vias (TSVs).

Keywords

automobiles; inertial navigation; microsensors; three-dimensional integrated circuits; accelerometers; angular rate detection; automobile applications; electronic stability control; environmental pressures; gyroscope; three axis MEMS inertial sensor; through silicon vias; two axis acceleration detection parts; two step WLP; two step wafer level package process; vibration immunity; Accelerometers; Gyroscopes; Micromechanical devices; Robot sensing systems; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2011 IEEE

Conference_Location

Limerick

ISSN

1930-0395

Print_ISBN

978-1-4244-9290-9

Type

conf

DOI

10.1109/ICSENS.2011.6126909

Filename

6126909