Fabrication of BeCu module probe array using heating and fusing currents

Author

Lee, Dongin ; Kim, Sangwon ; Kong, Daeyoung ; Cho, Chanseob ; Kim, Bonghwan ; Lee, Byeungleul ; Lee, Jonghyun

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Kyungpook Nat. Univ., Daegu, South Korea

fYear

2011

fDate

28-31 Oct. 2011

Firstpage

1732

Lastpage

1735

Abstract

We have developed a novel probe array using BeCu sheets, to solve the high-production-cost problem associated with conventional MEMS probe cards. The BeCu probe has a simple structure and offers several advantages such as ease of fabrication and rapid prototyping; further, the fabrication process is cost-effective. The proposed array was fabricated by applying a suitable heating current (for plastic deformation via Joule heating) and fusing current (for cutting the array) to a BeCu beam. The stress relaxation time was 7 min during the application of a heating current of 4 A, and the fusing current was 20 A. The fabricated probe array is suitable for use in various complicated semiconductor chip tests.

Keywords

beryllium compounds; microfabrication; microsensors; BeCu; BeCu module probe array; Joule heating; MEMS probe cards; fusing currents; heating currents; plastic deformation; semiconductor chip tests; Arrays; Fabrication; Force; Heating; Probes; Scanning electron microscopy; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2011 IEEE

Conference_Location

Limerick

ISSN

1930-0395

Print_ISBN

978-1-4244-9290-9

Type

conf

DOI

10.1109/ICSENS.2011.6126958

Filename

6126958