Title :
New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization
Author :
Pence, W.E. ; Krusius, J.P. ; Subrahmanyan, R. ; Li, C.-Y. ; Carrier, G. ; Francis, G.L. ; Paisley, R.J. ; Holleran, L.M.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
Abstract :
A glass-ceramic multichip packaging technology for high-I/O-count, large-area silicon chips is discussed. The module substrate material is a new glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./°C). This material possesses a low dielectric constant (5.2), resulting in reduced package signal propagation delays. A 3-in, 36-chip test vehicle has been designed, fabricated, and tested to assess the electrical and thermal properties of the glass-ceramic and its usefulness in packaging applications. Chip and module sizes equal to or greater than 1 cm and 3 in, respectively, are targets for this packaging technology, referred to as the hybrid systems module (HSM). The electrical design and characterization of the HSM test vehicle are described
Keywords :
ceramics; glass; hybrid integrated circuits; integrated circuit testing; modules; packaging; thermal expansion; 1 cm; 3 in; Corning 9641; TCE-matched; delay reduction; electrical characterisation; electrical design; glass-ceramic multi-chip module; high-I/O-count; hybrid systems module; large area Si chips; low dielectric constant; multichip packaging technology; package signal propagation delays; substrate material; thermal coefficient of expansion; thermal properties; Ceramics; Dielectric materials; Materials testing; Packaging; Silicon; Space technology; Thermal expansion; Thermal stresses; Transmission line measurements; Vehicles;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77819
