New TCE-matched glass-ceramic multi-chip module. II. Materials, mechanical, and thermal aspects

For pt.I see ibid., p.647-51 (1989). A glass-ceramic multichip packaging technology is discussed. The module substrate material is a glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./°C) and possesses a low dielectric constant (5.2). The 9641 substrate permits large-area silicon chips (~1 cm×1 cm) to be mounted using flip-chip techniques. Multilayer metallization (Au) layers in the substrate are screen printed, and the laminated assembly is cofired to produce a 3-in, 36-chip test module. Silicon test chips 1-cm square with 81 I/Os are mounted by flip-chip bonding (95/5 Pb-Sn). Chip and module sizes equal to or greater than 1 cm and 3 in, respectively, are targets for this technology, referred to as the hybrid systems module (HSM). Significant improvement in solder joint reliability permits larger chips to be mounted on the module without degradation in the mean time to failure of the solder joints. Processing, materials, and thermal characterization data are presented