DocumentCode
2966185
Title
Stock index prediction: A comparison of MARS, BPN and SVR in an emerging market
Author
Lu, Chi-jie ; Chang, Chih-Hsiang ; Chen, Chien-Yu ; Chiu, Chih-Chou ; Lee, Tian-Shyug
Author_Institution
Dept. of Ind. Eng. & Manage., Ching Yun Univ., Jungli, Taiwan
fYear
2009
fDate
8-11 Dec. 2009
Firstpage
2343
Lastpage
2347
Abstract
Stock index prediction seems to be a challenging task of the financial time series prediction process especially in emerging markets with their complex and inefficient structures. Multivariate adaptive regression splines (MARS) is a nonlinear and non-parametric regression methodology and has been successfully used in classification tasks. However, there are few applications using MARS in stock index prediction. In this study, we compare the forecasting performance of MARS, backpropagation neural network (BPN), support vector regression (SVR), and multiple linear regression (MLR) models in Shanghai B-Share stock index. Experimental results show that MARS outperforms BPN, SVR and MLR in terms of prediction error and prediction accuracy.
Keywords
backpropagation; economic forecasting; neural nets; nonparametric statistics; regression analysis; splines (mathematics); stock markets; BPN; MARS; SVR; Shanghai B-Share stock index; backpropagation neural network; emerging financial market; financial time series prediction process; multiple linear regression models; multivariate adaptive regression splines; nonlinear regression methodology; nonparametric regression methodology; prediction accuracy; prediction error; stock index prediction; support vector regression; Backpropagation; Economic forecasting; Energy management; Engineering management; Mars; Neural networks; Predictive models; Support vector machine classification; Support vector machines; Technology management; Multivariate adaptive regression splines; Neural network; Stock index prediction; Support vector regression;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-4869-2
Electronic_ISBN
978-1-4244-4870-8
Type
conf
DOI
10.1109/IEEM.2009.5373010
Filename
5373010
Link To Document